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 Thor Sewell presented at Intel's Update with Tech Field Day |
This Presentation date is April 7, 2021 at 8:45-9:45.
Presenters: Irma Esmer, Ram Ramakrishnan, Thor Sewell
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Technology Update on 3rd Gen Intel Xeon Scalable Processors
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Get the details about Intel’s latest Xeon Scalable processors, allowing customers to benefit from new capabilities built for industry-leading performance and flexibility from the edge to the cloud. Learn more about the platforms new enhancements including: Built-in security (SGX), built-in AI (Intel DL Boost) and built-in crypto acceleration. Presented by Thor Sewell, Product Line Director, Data Platforms Group (DPG), Intel Corporation.
Personnel: Thor Sewell
Architectural Deep Dive for 3rd Gen Intel Xeon Scalable Platform
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Irma Esmer Papazian, Senior Principal Engineer, Lead Architect, Data Center Processor Architecture, gives a deeper look into the third generation Intel Xeon Scalable processor platform known as Ice Lake. She begins with an overview of the 3rd gen architecture and how “Ice Lake-SP” is positioned in the market with next-generation compute, memory, IO, and scaling. She then discusses the “Sunny Cove” core microarchitecture improvements and new instructions for cryptography and compression. This includes improvements in processing latency under changing power settings. Next she discusses Intel’s Software Guard Extensions (SGX) for trusted computing, Optane Persistent Memory capabilities in PMem 200 (“Barlow Pass”), and Optane SSD P5800X. This presentation also features Ram Ramakrishnan, Director Datacenter Performance, Data Platforms Group (DPG), and Thor Sewell, Product Line Director, Data Platforms Group (DPG), and the Tech Field Day delegates.
Personnel: Irma Esmer, Ram Ramakrishnan, Thor Sewell
Technical and Performance Overview for 3rd Gen Intel Xeon Scalable Platform
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Ram Ramakrishnan, Director Datacenter Performance, Data Platforms Group (DPG), discusses the performance improvements in Intel’s third generation Intel Xeon Scalable processor platform known as Ice Lake-SP. After a brief overview of the 3rd generation Xeon Scalable Platform, he compares performance of Ice Lake with Cascade Lake, Skylake, Broadwell, and Haswell Xeon platforms. He then discusses the impact of new instructions and capabilities like DDIO, AVX-512, Crypto Acceleration, DL Boost (VNNI int8 vs. fp32), and performance in many applications, from infrastructure and web services to HPC and AI. Considering the entire platform, including Optane Persistent Memory and SSD and Ethernet 800, performance is dramatically improved in many server workloads.
Personnel: Ram Ramakrishnan