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You are here: Home / Videos / Micron’s Roadmap for Memory and Storage Innovation

Micron’s Roadmap for Memory and Storage Innovation



Tech Field Day 23


This video is part of the appearance, “Micron Presents at Tech Field Day 23“. It was recorded as part of Tech Field Day 23 at 13:30-15:30 on April 21, 2021.


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Malcolm Humphrey, VP, General Manager, Core Compute and Networking Business Unit, discusses Micron’s roadmap for memory and storage innovation along with Roger Peene, Vice President and GM, Data Center Storage, Storage Business Unit. Memory and storage innovation is critical to data center evolution. On the memory side, Micron offers a complete memory portfolio to address current workload needs – HBM, DDR, LPDDR and GDDR and has a vision for the future data center that includes the DDR5 transition as well as CXL attached memory. On the storage side, Micron’s vision includes fast storage, capacity storage, HDD storage and archival storage. We are working with the industry to evolve SSD form factors to meet our customer’s needs and get to a composable future.

Personnel: Malcolm Humphrey, Roger Peene


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