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You are here: Home / Appearances / Intel Presents at Networking Field Day 25

Intel Presents at Networking Field Day 25



Networking Field Day 25

Petr Kastovsky Presented at Networking Field Day

This Presentation date is May 12, 2021 at 11:00-13:00.

Presenters: Petr Kastovsky, Robert Blum, Scott Schube, Todd Rimmer


Follow on Twitter using the following hashtags or usernames: #NFD25


Optimizing Workloads in Hyperscale and Edge Computing with Intel Tofino X


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Intel Tofino is a high-throughput, P4-programmable Ethernet switch ASIC that, through its inherent flexibility, can be deployed in many parts of the network. When combined with an Intel® FPGA, operators are further empowered to implement more functionality and scale up the platform through richer packet processing.

Personnel: Petr Kastovsky

High Performance Networking (HPN) with Intel Ethernet


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Intel Ethernet is already used in high performance computing but limited in scaling and performance.  In this session, we will describe what Intel is doing to expand Ethernet’s use in HPC and other workloads requiring a high performance fabric. You will learn about the software Intel is delivering, performance and where Intel believes Ethernet will fit into the High Performance world over the next few years.

Personnel: Todd Rimmer

Optical Networking at Scale with Intel Silicon Photonics


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Intel Silicon Photonics is a key technology for moving data between servers and switches across large data centers. This presentation discusses the advancements Intel has made in Silicon Photonics over the last four years since first launching 100Gb/s transceivers and how manufacturing optics at scale has resulted in the deployment of more than 5 million transceivers for hyperscale data centers to date. To support the exponential growth in data traffic, 200Gb/s and 400Gb/s optical transceivers are ramping up now, and some cloud service providers are starting to evaluate 800Gb/s. We will discuss industry trends in optical networking inside data centers and review the key building blocks of pluggable optical transceivers. The presentation will also look at the benefits of co-packaged optics, which is expected to begin deployment in the next 2-3 years. A brief outlook on future applications of high volume Silicon Photonics beyond the data center will conclude the presentation.

Personnel: Robert Blum, Scott Schube

Tagged With: #NFD25
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